Revolutionizing Unmanned Systems: Samtec Unveils the UxV/35-FleXYZ™ Interconnect Series

July 1, 2026 – In a significant move to standardize the rapidly expanding landscape of unmanned systems, Samtec, Inc.—a global leader in the connector industry—has officially announced the launch of its UxV/35-FleXYZ™ ESQT series. This new line of durable, high-performance interconnect systems is specifically engineered to meet the stringent demands of small, unmanned craft, providing a versatile, modular, and ruggedized solution for developers and system integrators worldwide.

As the unmanned vehicle sector shifts from bespoke, custom-built prototypes to scalable, interoperable platforms, the demand for standardized architecture has reached a fever pitch. By aligning with the RMS Consortium’s UxV/35 standard, Samtec is providing the critical hardware infrastructure necessary to accelerate the development, deployment, and field-readiness of autonomous vehicles.


The Core Innovation: Engineering the UxV/35-FleXYZ™ System

The UxV/35-FleXYZ™ ESQT series is not merely a collection of connectors; it is a sophisticated, modular architectural tool designed to facilitate the "stack and nest" requirements of modern flight and vehicle controllers. Built upon a 2 mm grid with a robust 3×3 pin configuration, the system provides a flexible, vertical 35-pin bus that adapts seamlessly to varying design footprints and enclosure constraints.

Modular Architecture for Rapid Prototyping

The genius of the FleXYZ™ design lies in its granular configuration. The series consists of 9-pin and 8-pin connectors, available in both long-pin and short-pin variants. By combining three 9-pin units with a single 8-pin connector—which serves as a vital keying guide for error-proof assembly—engineers can construct a standardized 35-pin bus. This modularity allows designers to mix and match functional modules, such as electronic speed controls (ESCs), power distribution units, communication arrays, and flight computers, without the need for extensive rewiring or custom PCB redesigns.

Durability and Reliability in Extreme Environments

Operating in the field requires more than just electrical connectivity; it requires mechanical resilience. Samtec’s design philosophy for the UxV/35 series prioritizes "ruggedization," ensuring that these connectors can withstand the vibration, thermal shock, and environmental stressors typical of unmanned aerial and ground vehicles. The series has undergone rigorous testing, including power integrity assessments, severe environmental stress screening, and solder heat resistance evaluations, ensuring that the critical "nerve center" of an unmanned vehicle remains intact during high-G maneuvers or extended field deployments.


The UxV/35 Standard: A Catalyst for Industry Growth

To understand the impact of Samtec’s new interconnects, one must first understand the standard they support. The RMS Consortium’s UxV/35 standard was established to solve the "tower of Babel" problem that has long plagued the unmanned systems industry. Previously, integrating components from different manufacturers required proprietary interfaces, excessive cabling, and unique mechanical layouts, which stifled innovation and ballooned costs.

Streamlining the Design Lifecycle

The UxV/35 standard provides a comprehensive framework for small, unmanned craft, covering:

  • Mechanical Definitions: Standardized connector definitions that ensure physical compatibility across different modules.
  • PCB Layout Guidelines: Unified design rules that reduce the time-to-market for new hardware.
  • Electrical Interfacing: Standardized pin mapping to ensure power and data signals are consistent throughout the system.
  • Power Distribution: A unified framework that simplifies the electrical architecture, reducing the reliance on bulky and inefficient power-conversion modules.

By providing a "snap-together" system that minimizes internal wiring, the UxV/35 standard lowers the barrier to entry for smaller manufacturers and allows larger aerospace firms to focus on core competency rather than connector routing.


Chronology of Development: From Concept to Standardization

The journey toward the UxV/35-FleXYZ™ release reflects a multi-year effort to harmonize the needs of defense, industrial, and commercial unmanned systems.

  • Early 2024: The RMS Consortium identifies a critical need for a standardized, high-density interconnect system capable of supporting modular unmanned systems. Discussions begin regarding the requirements for a 35-pin vertical bus.
  • Late 2024 – 2025: Samtec, leveraging its decades of expertise in high-speed and micro-rugged interconnects, engages with consortium members to define the mechanical and electrical specifications. The goal is to move beyond fragile, consumer-grade connectors toward a true industrial-grade, stackable solution.
  • Early 2026: Prototype validation occurs. Samtec optimizes the FleXYZ™ pin-nesting mechanism to ensure ease of assembly for non-expert users while maintaining high electrical performance.
  • July 1, 2026: Official market release. The UxV/35-FleXYZ™ series enters the global catalog, accompanied by full documentation, including PADS files and comprehensive environmental test reports.

Supporting Data: Why "USA-Sourced" Matters

In an era of global supply chain volatility, the origin of electronic components has become a matter of national security, particularly for companies operating in the defense and critical infrastructure sectors. Samtec has opted for a distinctive blue housing for the UxV/35-FleXYZ™ series to serve as a visual indicator of its domestic origin.

Technical Performance Metrics

Beyond the aesthetic, the technical performance of the FleXYZ™ series is backed by empirical data. Samtec’s product page offers:

  • Power Integrity Reports: Validating the system’s ability to handle the current demands of modern flight controllers.
  • Thermal Resistance Data: Ensuring that even in confined, high-density enclosures, the connectors do not suffer from thermal fatigue.
  • Mechanical Prints: Providing exact dimensions for engineers to integrate the 35-pin footprint into their CAD environments, reducing the margin for error in the early design stages.

Implications for the Unmanned Industry

The implications of this launch are far-reaching. By adopting a unified, rugged, and readily available standard, the unmanned systems industry is poised to move toward a "Lego-like" manufacturing model.

1. Increased Interoperability

With the UxV/35-FleXYZ™ series, an operator could potentially swap a communication module from one manufacturer with a flight controller from another, provided both adhere to the UxV/35 standard. This interoperability creates a more competitive market where hardware innovation is rewarded over vendor lock-in.

2. Lowering Costs and Time-to-Market

The elimination of bespoke, hand-wired connectors significantly reduces assembly time and the risk of human error during production. For small startups, this means they can focus their limited capital on software and application-specific hardware rather than basic interconnect plumbing.

3. Scalability

The "stack and nest" capability of the FleXYZ™ architecture means that as vehicle requirements grow in complexity, the hardware can grow with them. A basic drone can be upgraded to an advanced autonomous platform by simply stacking additional modules onto the existing 35-pin bus, preserving the initial investment in the base chassis.


About Samtec, Inc.

Samtec is not merely a supplier; it is a $1 billion global force in the electronics manufacturing industry. Known for its "Sudden Service" philosophy, the company operates in over 125 countries, providing high-speed board-to-board, cable, and micro-rugged interconnects. Their involvement in the UxV/35 standard underscores their commitment to the future of robotics and autonomy.

As the industry moves toward 2030, the ability to rapidly iterate and deploy unmanned systems will define the winners in both the commercial and defense sectors. Through the UxV/35-FleXYZ™ ESQT series, Samtec has provided the building blocks for that future, ensuring that as unmanned craft become more sophisticated, the hardware that holds them together remains as durable and adaptable as the missions they are designed to perform.

For more information on the standard or to access technical resources, developers are encouraged to visit the RMS Consortium website or explore the Samtec UXV/35 product page.